訊憶科技
|
|
|
|
訊憶科技股份有限公司 |
|
獨立公司
|
|
|
|
生技/動植 |
|
未上市公司
|
|
未公開發行
|
|
桃園縣龍潭鄉中原路二段100號 |
|
|
統一編號 |
28744777 |
|
338,000,000 |
上市代號 |
000005 |
|
03-4117922 |
公司傳真 |
|
|
|
興櫃日期 |
|
|
|
簽證會計師 |
|
|
|
|
|
|
|
|
PCBA
TSV Application
WLCSP
智能卡模組
付費晶片貼卡
LED 照明模組
觸碰面板模組
金凸塊產品
CC01080 電子零組件製造業
CC01110 電腦及其週邊設備製造業
CC01990 其他電機及電子機械器材製造業
I301010 資訊軟體服務業
I501010 產品設計業
IZ99990 其他工商服務業
F119010 電子材料批發業
F219010 電子材料零售業
F401010 國際貿易業
ZZ99999 除許可業務外,得經營法令非禁止或限制之業務
|
|
|
|
|
|
|
|
AFlash Technology Co., Ltd., founded in Taiwan in Jun 2007. AFlash Technology's mission is to create innovative Wafer Level Chip Scale Packaging (CSP) concepts, methods and products for manufacturing, licensing and distribution.
Aflash has developed innovative Redistribution Layer Technology which with unmatched benefits for Flash Memory, DRAM Modules and other applications; and enables revolutionary TSV Technology which creates multiple benefits to the product, such likes smaller form factor, better package electrical performance, flexibility to Multi-Chip Packages or die stacking; all those benefits can be achieved under low process cost and high efficiency, various package requirements can be met for now and future.
Aflash's management policies are Integrity, Innovation and Services, our teams are continuously providing innovative technologies and keep improving our manufacture ability, we are entrusted to provide reliable solution to the industrial.
Milestone
. 2007 Jun Aflash Technology founded
. 2008 Nov TSV/RDL technology applied multiple country patent
. 2008 Sep ISO 9001 certification
. 2009 Dec ISO 14001/OHSAS 18001 certification
. 2010 Mar Smart Card Module Ramp-up
. 2011 Jan Lift-Off process set up and start BIZ |
|
|
|
|
|